JPH0130299B2 - - Google Patents

Info

Publication number
JPH0130299B2
JPH0130299B2 JP55066855A JP6685580A JPH0130299B2 JP H0130299 B2 JPH0130299 B2 JP H0130299B2 JP 55066855 A JP55066855 A JP 55066855A JP 6685580 A JP6685580 A JP 6685580A JP H0130299 B2 JPH0130299 B2 JP H0130299B2
Authority
JP
Japan
Prior art keywords
tape
chip
bonding
chips
moved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55066855A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56162846A (en
Inventor
Yoshiaki Tanaka
Shunichi Takagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP6685580A priority Critical patent/JPS56162846A/ja
Publication of JPS56162846A publication Critical patent/JPS56162846A/ja
Publication of JPH0130299B2 publication Critical patent/JPH0130299B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP6685580A 1980-05-20 1980-05-20 Ic gang bonding device Granted JPS56162846A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6685580A JPS56162846A (en) 1980-05-20 1980-05-20 Ic gang bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6685580A JPS56162846A (en) 1980-05-20 1980-05-20 Ic gang bonding device

Publications (2)

Publication Number Publication Date
JPS56162846A JPS56162846A (en) 1981-12-15
JPH0130299B2 true JPH0130299B2 (en]) 1989-06-19

Family

ID=13327876

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6685580A Granted JPS56162846A (en) 1980-05-20 1980-05-20 Ic gang bonding device

Country Status (1)

Country Link
JP (1) JPS56162846A (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58142534A (ja) * 1982-02-19 1983-08-24 Nec Corp フイルムキヤリアボンデイング装置
JPS58165335A (ja) * 1982-03-26 1983-09-30 Nec Corp テ−プキヤリア方式による半導体装置の製造方法及びその製造装置

Also Published As

Publication number Publication date
JPS56162846A (en) 1981-12-15

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